ISD1730 / ( 掩膜芯片 ) / 华邦 ISD/WinbondISD

产品型号 :   ISD1730 芯片厂家品牌 :   华邦 ISD/WinbondISD   
基本芯片参数:(Winbond ISD,华邦 ISD,ISD1730,20-60 sec 秒)环 芯 特性:    Duration: 20-60 sec 秒;Sample Rate (kHz): 4.0~12.0

ISD1730 20-60 sec 秒
Duration: 20-60 sec 秒;Sample Rate (kHz): 4.0~12.0
芯片原厂掩膜芯片Mask-IC
Duration: 20-60 sec 秒;Sample Rate (kHz): 4.0~12.0; Status*: P; RoHS: Y; Development Tools: ISD-COB1730 ISD-ES17xx_USB_PB

Winbond ISD,华邦 ISD,ISD1730,20-60 sec 秒语音芯片OTP掩膜芯片开发
华邦电子是一家专业的利基型内存IC设计、制造与销售公司,从产品设计、技术研发、晶圆制造到自有品牌营销全球,华邦致力提供全球客户全方位的中低密度利基型内存解决方案服务. 并购美国 Information Storage Devices (ISD)公司 WinbondISD语音芯片系列原厂LOGO
语音芯片型号参考 : ISD1730,更多详情咨询环芯销售人员,谢谢!
芯片常见应用类别 : 掩膜芯片 !(经典名曲资料来源于网络收录)
ISD1730常用应用场合,和开发下单流程 :
Status*: P; RoHS: Y; Development To ATCHIP.comols: ISD-COB1730 ISD-ES17xx_USB_PB环芯
Status*: P; RoHS: Y; Development Tools: ISD-COB1730 ISD-ES17xx_USB_PB
ISD1730产品详细参数内容解析 :
ISD1730 20-60 sec 秒

ATChip.comStatus*: P; RoHS: Y; Development Tools: ISD-COB1730 ISD-ES17xx_USB_PB
DIP 28; SOIC 28;  TSOP 28; DIE
(开发语音识别码:18918)
DIP 28; SOIC 28;  TSOP 28; DIE
ISD1730相关流程费用(掩膜IC / Mask IC) : 参考相关1704+批:价格:.88/pcs

掩膜芯片为大批量订单生产芯片,需要支付相关掩膜费用
掩膜费用收取标准有两种,可分为不可退(可下最小订单量MOQ,达到MFQ数量不退)与可退(两年内达到掩膜费数量退回MFQ),掩膜和OTP芯片原厂生产出来后是芯片的裸片形式(DICE)交货,然后进行绑定加工生产COB软封装,如果需要进行硬封装,也可以特定WAFER交货。

ISD1730为掩膜IC,MOQ最小订单量:1000,RFQ返回掩膜费量:7000
不可退掩膜费(Non-Refund)为1000美金(换算人民币);

可退掩膜费(Refundable mask charge)为1500美金

部分语音芯片厂家会进行芯片功能工艺更新的版本升级,如:A版B版C版D版E版F版G版H版J版K版X版等多个版本
我司会不定期对产品资料进行更新,如有变动,恕不另行通知!
ISD1730产品系列 : ISD1730生成原厂资料 :
ISD1730英文产品介绍:
The Winbond® ISD1700 ChipCorder® Series is a high quality, fully integrated, single-chip multimessage voice record and playback device ideally suited to a variety of electronic systems. The message duration is user selectable in ranges from 26 seconds to 120 seconds, depending on the specific device. The sampling frequency of each device can also be adjusted from 4 kHz to 12 kHz with an external resistor, giving the user greater flexibility in duration versus recording quality for each application. Operating voltage spans a range from 2.4 V to 5.5 V to ensure that the ISD1700 devices are optimized for a wide range of battery or line-powered applications.yueic.com
ISD1730中文产品介绍 :
 ISD1700 Series Multi-Message Single-Chip Voice Record & Playback Devices
1 GENERAL DESCRIPTION
The Winbond® ISD1700 ChipCorder® Series is a high quality, fully integrated, single-chip multimessage
voice record and playback device ideally suited to a variety of electronic systems. The
message duration is user selectable in ranges from 26 seconds to 120 seconds, depending on the
specific device. The sampling frequency of each device can also be adjusted from 4 kHz to 12 kHz
with an external resistor, giving the user greater flexibility in duration versus recording quality for each
application. Operating voltage spans a range from 2.4 V to 5.5 V to ensure that the ISD1700 devices
are optimized for a wide range of battery or line-powered applications.
The ISD1700 is designed for operation in either standalone or microcontroller (SPI) mode. The device
incorporates a proprietary message management system that allows the chip to self-manage address
locations for multiple messages. This unique feature provides sophisticated messaging flexibility in a
simple push-button environment. The devices include an on-chip oscillator (with external resistor
control), microphone preamplifier with Automatic Gain Control (AGC), an auxiliary analog input, antialiasing
filter, Multi-Level Storage (MLS) array, smoothing filter, volume control, Pulse Width
Modulation (PWM) Class D speaker driver, and current/voltage output.
The ISD1700 devices also support an optional “vAlert” (voiceAlert) feature that can be used as a new
message indicator. With vAlert, the device flashes an external LED to indicate that a new message is
present. Besides, four special sound effects are reserved for audio confirmation of operations, such as
“Start Record”, “Stop Record”, “Erase”, “Forward”, “Global Erase”, and etc.
Recordings are stored into on-chip Flash memory, providing zero-power message storage. This unique
single-chip solution is made possible through Winbond’s patented Multi-Level Storage (MLS)
technology. Audio data are stored directly in solid-state memory without digital compression, providing
superior quality voice and music reproduction.
Voice signals can be fed into the chip through two independent paths: a differential microphone input
and a single-ended analog input. For outputs, the ISD1700 provides a Pulse Width Modulation (PWM)
Class D speaker driver and a separate analog output simultaneously. The PWM can directly drive a
standard 8Ω speaker or typical buzzer, while the separate analog output can be configured as a
single-ended current or voltage output to drive an external amplifier.
While in Standalone mode, the ISD1700 devices automatically enter into power down mode for power
conservation after an operation is completed.
In the SPI mode, the user has full control via the serial interface in operating the device. This includes
random access to any location inside the memory array by specifying the start address and end
address of operations. SPI mode also allows access to the Analog Path Configuration (APC) register.
This register allows flexible configuration of audio paths, inputs, outputs and mixing. The APC default
configuration for standalone mode can also be modified by storing the APC data into a non-volatile
register (NVCFG) that is loaded at initialization. Utilizing the capabilities of ISD1700 Series, designers
have the control and flexibility to implement voice functionality into the high-end products.
 
Notice: The specifications are subject to change without notice. Please contact Winbond Sales Offices or
Representatives to verify current or future specifications. Also refer to the website for any related application notes


ISD17系列产品线:ISD17240, ISD17210, ISD17180, ISD17150, ISD17120, ISD1790, ISD1760, ISD1750, ISD1740, ISD1730, ISD1700
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深圳市环芯半导体有限公司是一家专业的语音芯片和音乐芯片技术开发公司。 语音类的芯片主要有:1,AC8040,AC9080语音OTP,AC8VC特价8脚芯片,AC8VM特价8脚芯片等。2,标准品,动物叫语音芯片,圣诞老公公,常见短秒数标准品,自然声产品,鬼叫灯音效产品等。3,裸片类IC(Dice),语音音乐标准品,各种开发掩膜芯片,裸片芯片可以封装到COB或者硬封装芯片。
更多语音芯片厂家
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